Issued Patents All Time
Showing 25 most recent of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388032 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Ji Young Chung, Choon Heung Lee | 2025-08-12 |
| 12362343 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2025-07-15 |
| 12211705 | Stiffener package and method of fabricating stiffener package | Jin Young Kim, Seung Jae Lee | 2025-01-28 |
| 11961742 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2024-04-16 |
| 11935856 | Semiconductor device having a redistribution layer | Jong Sik Paek | 2024-03-19 |
| 11764078 | Stiffener package and method of fabricating stiffener package | Jin Young Kim, Seung Jae Lee | 2023-09-19 |
| 11748980 | Makeup evaluation system and operating method thereof | Sang Eun Kim, Do-Hyuk Kwon, Do Sik Hwang, Tae-Seong Kim, Ki Hun Bang +3 more | 2023-09-05 |
| 11600582 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Ji Young Chung, Choon Heung Lee | 2023-03-07 |
| 11527496 | Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof | Jong Sik Paek, Won Chul Do, Eun Ho Park, Sung Jae Oh | 2022-12-13 |
| 11501978 | Semiconductor device and manufacturing method thereof | Won Chul Do, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2022-11-15 |
| 11424180 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2022-08-23 |
| 11183493 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2021-11-23 |
| 11113511 | Makeup evaluation system and operating method thereof | Sang Eun Kim, Do-Hyuk Kwon, Do Sik Hwang, Tae-Seong Kim, Ki Hun Bang +3 more | 2021-09-07 |
| 11107701 | Stiffener package and method of fabricating stiffener package | Jin Young Kim, Seung Jae Lee | 2021-08-31 |
| 11101144 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2021-08-24 |
| 11043464 | Semiconductor device having upper and lower redistribution layers | Jong Sik Paek | 2021-06-22 |
| 10985031 | Semiconductor device and manufacturing method thereof | Won Chul Do, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2021-04-20 |
| 10707181 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Ji Young Chung, Choon Heung Lee | 2020-07-07 |
| 10679952 | Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof | Jong Sik Paek, Won Chul Do, Eun Ho Park, Sung Jae Oh | 2020-06-09 |
| 10672699 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2020-06-02 |
| 10535536 | Stiffener package and method of fabricating stiffener package | Jin Young Kim, Seung Jae Lee | 2020-01-14 |
| 10515825 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2019-12-24 |
| 10388643 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2019-08-20 |
| 10297466 | Semiconductor device and manufacturing method thereof | Won Chul Do, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2019-05-21 |
| 10224217 | Wafer level fan out package and method of fabricating wafer level fan out package | Jin Young Kim, Seung Jae Lee | 2019-03-05 |