Issued Patents All Time
Showing 25 most recent of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347737 | Semiconductor device with a porous air vent | — | 2025-07-01 |
| 12125816 | Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (RDL) and methods for making the same | Po Chih Yang | 2024-10-22 |
| 12051684 | Face-to-face semiconductor device with fan-out porch | Yeongbeom Ko | 2024-07-30 |
| 11961742 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2024-04-16 |
| 11942430 | Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules | — | 2024-03-26 |
| 11942455 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Youngik Kwon, Jungbae Lee | 2024-03-26 |
| 11935856 | Semiconductor device having a redistribution layer | Doo Hyun Park | 2024-03-19 |
| 11855023 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Choon Heung Lee, In Bae Park, Sang Won Kim, Sung Kyu Kim +1 more | 2023-12-26 |
| 11842970 | Semiconductor package and manufacturing method thereof | No Sun Park | 2023-12-12 |
| 11764161 | Ground connection for semiconductor device assembly | Youngik Kwon, Yeongbeom Ko | 2023-09-19 |
| 11749665 | Face-to-face semiconductor device with fan-out porch | Yeongbeom Ko | 2023-09-05 |
| 11527496 | Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2022-12-13 |
| 11515174 | Semiconductor devices with package-level compartmental shielding and associated systems and methods | Youngik Kwon | 2022-11-29 |
| 11501978 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Ji Hun Lee, Seong Min Seo | 2022-11-15 |
| 11456289 | Face-to-face semiconductor device with fan-out porch | Yeongbeom Ko | 2022-09-27 |
| 11424180 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee, Se Woong Cha +4 more | 2022-08-23 |
| 11362071 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Youngik Kwon, Jungbae Lee | 2022-06-14 |
| 11121102 | Semiconductor package and manufacturing method thereof | No Sun Park | 2021-09-14 |
| 11101144 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2021-08-24 |
| 11043464 | Semiconductor device having upper and lower redistribution layers | Doo Hyun Park | 2021-06-22 |
| 10985031 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Ji Hun Lee, Seong Min Seo | 2021-04-20 |
| 10903181 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Choon Heung Lee, In Bae Park, Sang Won Kim, Sung Kyu Kim +1 more | 2021-01-26 |
| 10679952 | Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2020-06-09 |
| 10672699 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee, Se Woong Cha +4 more | 2020-06-02 |
| 10535620 | Semiconductor package and manufacturing method thereof | No Sun Park | 2020-01-14 |