Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942455 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Jong Sik Paek, Jungbae Lee | 2024-03-26 |
| 11764161 | Ground connection for semiconductor device assembly | Jong Sik Paek, Yeongbeom Ko | 2023-09-19 |
| 11621245 | Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems | Yeongbeom Ko, Jungbae Lee | 2023-04-04 |
| 11515174 | Semiconductor devices with package-level compartmental shielding and associated systems and methods | Jong Sik Paek | 2022-11-29 |
| 11362071 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Jong Sik Paek, Jungbae Lee | 2022-06-14 |