Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412824 | Semiconductor packages and methods of forming the same | Junyun Kweon, Wooju Kim, Heejae Nam, Haemin Park, Junggeun Shin | 2025-09-09 |
| 12300667 | Semiconductor package and method of fabricating the same | — | 2025-05-13 |
| 12051684 | Face-to-face semiconductor device with fan-out porch | Jong Sik Paek | 2024-07-30 |
| 12015005 | Semiconductor package including non-conductive film and method for forming the same | Wooju Kim, Heejae Nam, Jungseok Ryu, Haemin Park | 2024-06-18 |
| 11942455 | Stacked semiconductor dies for semiconductor device assemblies | Youngik Kwon, Jong Sik Paek, Jungbae Lee | 2024-03-26 |
| 11764161 | Ground connection for semiconductor device assembly | Jong Sik Paek, Youngik Kwon | 2023-09-19 |
| 11749665 | Face-to-face semiconductor device with fan-out porch | Jong Sik Paek | 2023-09-05 |
| 11621245 | Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems | Youngik Kwon, Jungbae Lee | 2023-04-04 |
| 11456289 | Face-to-face semiconductor device with fan-out porch | Jong Sik Paek | 2022-09-27 |
| 11362071 | Stacked semiconductor dies for semiconductor device assemblies | Youngik Kwon, Jong Sik Paek, Jungbae Lee | 2022-06-14 |
| 8936969 | Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape | HunTeak Lee, DaeWook Yang | 2015-01-20 |
| 8716108 | Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof | Hun Teak Lee, DaeWook Yang | 2014-05-06 |
| 8709877 | Integrated circuit packaging system with an encapsulation and method of manufacture thereof | DaeWook Yang | 2014-04-29 |
| 8546957 | Integrated circuit packaging system with dielectric support and method of manufacture thereof | WonJun Ko, DeokKyung Yang | 2013-10-01 |