Yeongbeom Ko has been granted 14 US patents while listed as an inventor at Micron . The first was granted in 2013 and the most recent in September 2025. Yeongbeom Ko ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Yeongbeom Ko in Suwon-si, ID, KR.
Patents per Year Patents granted per year, 2013 to 2025 Bar chart with a peak of 3 patents in 2023. peak 3 2013: 1 patents 2013 2014: 2 patents 2014 2015: 1 patents 2015 2022: 2 patents 2022 2023: 3 patents 2023 2024: 3 patents 2024 2025: 2 patents 2025 Issued Patents All Time
Showing 1–14 of 14 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
12412824 Semiconductor packages and methods of forming the same Junyun Kweon , Wooju Kim , Heejae Nam , Haemin Park , Junggeun Shin 2025-09-09
12300667 Semiconductor package and method of fabricating the same — 2025-05-13
12051684 Face-to-face semiconductor device with fan-out porch Jong Sik Paek 2024-07-30
$28,317,000
12015005 Semiconductor package including non-conductive film and method for forming the same Wooju Kim , Heejae Nam , Jungseok Ryu , Haemin Park 2024-06-18
11942455 Stacked semiconductor dies for semiconductor device assemblies Youngik Kwon , Jong Sik Paek , Jungbae Lee 2024-03-26
$24,732,000
11764161 Ground connection for semiconductor device assembly Jong Sik Paek , Youngik Kwon 2023-09-19
$11,511,000
11749665 Face-to-face semiconductor device with fan-out porch Jong Sik Paek 2023-09-05
$12,684,000
11621245 Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems Youngik Kwon , Jungbae Lee 2023-04-04
$16,794,000
11456289 Face-to-face semiconductor device with fan-out porch Jong Sik Paek 2022-09-27
$13,053,000
11362071 Stacked semiconductor dies for semiconductor device assemblies Youngik Kwon , Jong Sik Paek , Jungbae Lee 2022-06-14
$13,168,000
8936969 Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape HunTeak Lee , DaeWook Yang 2015-01-20
8716108 Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof Hun Teak Lee , DaeWook Yang 2014-05-06
8709877 Integrated circuit packaging system with an encapsulation and method of manufacture thereof DaeWook Yang 2014-04-29
8546957 Integrated circuit packaging system with dielectric support and method of manufacture thereof WonJun Ko , DeokKyung Yang 2013-10-01
