Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Face-to-face semiconductor device with fan-out porch

Face-to-face semiconductor device with fan-out porch

US Patent 11749665 · Granted Sep 5, 2023

Estimated economic value: $12,684,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor packages and methods of forming the same2025
Semiconductor device with a porous air vent2025
Semiconductor package and method of fabricating the same2025
Semiconductor device assemblies and systems with one or more dies at least parti2024
Face-to-face semiconductor device with fan-out porch2024
Face-to-face semiconductor device with fan-out porch2024
Semiconductor package including non-conductive film and method for forming the s2024
Semiconductor device and manufacturing method thereof2024
Stacked die modules for semiconductor device assemblies and methods of manufactu2024
Stacked semiconductor dies for semiconductor device assemblies2024
Stacked semiconductor dies for semiconductor device assemblies2024
Semiconductor device having a redistribution layer2024