Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412824 | Semiconductor packages and methods of forming the same | Yeongbeom Ko, Junyun Kweon, Wooju Kim, Heejae Nam, Haemin Park | 2025-09-09 |
| 12062626 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Heejae Nam, Byungmoon Bae, Hyunsu Sim, Junho Yoon +1 more | 2024-08-13 |
| 11854892 | Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them | Junho Yoon, Jungchul Lee, Byungmoon Bae, Hyunsu Sim | 2023-12-26 |
| 11676914 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Heejae Nam, Byungmoon Bae, Hyunsu Sim, Junho Yoon +1 more | 2023-06-13 |
| 11322405 | Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them | Junho Yoon, Jungchul Lee, Byungmoon Bae, Hyunsu Sim | 2022-05-03 |