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2024-05-07 |
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Ingi Kim, Minhwan Seo, Sangwoo Bae, Akinori Okubo, Eunhee Jeang |
2024-04-02 |
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Hyperspectral imaging (HSI) apparatus and inspection apparatus including the same |
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2024-02-13 |
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Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them |
Junho Yoon, Byungmoon Bae, Junggeun Shin, Hyunsu Sim |
2023-12-26 |
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Light source and extreme ultraviolet light source system using the same |
Dohyung Kim, Seongchul Hong, Kyungsik Kang, Kyungbin Park, Motoshi Sakai +1 more |
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Wafer inspection apparatus and system including the same |
Kyunghun Han, Ingi Kim, Sangwoo Bae, Minhwan Seo, Myeongock Ko +3 more |
2023-11-21 |
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Laser beam delivery apparatus for extreme ultra violet light source |
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Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them |
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2022-05-03 |
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Apparatuses for bonding semiconductor chips |
Yisung Hwang, Jaehong Kim, Taegyeong Chung |
2020-04-21 |
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Micro-fluid measuring apparatus with an actuator and a tuning fork |
Donghyuk Lee, Sangken Kauh, Joonhui Kim, Nam-Joon Cho |
2019-02-12 |
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Apparatuses for bonding semiconductor chips |
Yisung Hwang, Jaehong Kim, Taegyeong Chung |
2018-09-25 |
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Apparatuses for bonding semiconductor chips |
Yisung Hwang, Jaehong Kim, Taegyeong Chung |
2017-07-11 |
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Device for calorimetric measurement |
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Microcantilever heater-thermometer with integrated temperature-compensated strain sensor |
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