Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629461 | Apparatuses for bonding semiconductor chips | Yisung Hwang, Jungchul Lee, Jaehong Kim | 2020-04-21 |
| 10083846 | Apparatuses for bonding semiconductor chips | Yisung Hwang, Jungchul Lee, Jaehong Kim | 2018-09-25 |
| 9704732 | Apparatuses for bonding semiconductor chips | Yisung Hwang, Jungchul Lee, Jaehong Kim | 2017-07-11 |
| 8051555 | Circuit manufacturing apparatus | Minill Kim, Jonggi Lee, Kwang-Yong Lee | 2011-11-08 |