Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412824 | Semiconductor packages and methods of forming the same | Yeongbeom Ko, Wooju Kim, Heejae Nam, Haemin Park, Junggeun Shin | 2025-09-09 |
| 12347760 | Interconnection structure and semiconductor package including the same | Jumyong Park, Jin Ho An, Dongjoon Oh, Jeonggi Jin, Hyunsu Hwang | 2025-07-01 |
| 12224256 | Wafer structure and semiconductor device | Hyunsu Hwang, Jumyong Park, Solji Song, Dongjoon Oh, Chungsun Lee | 2025-02-11 |
| 12009288 | Interconnection structure and semiconductor package including the same | Dongjoon Oh, Jumyong Park, Jin Ho An, Chungsun Lee, Hyunsu Hwang | 2024-06-11 |
| 11923309 | Semiconductor package including fine redistribution patterns | Hyunsu Hwang, Jumyong Park, Jin Ho An, Dongjoon Oh, Chungsun Lee +1 more | 2024-03-05 |
| 11854893 | Method of manufacturing semiconductor package | Jumyong Park, Solji Song, Dongjoon Oh, Chungsun Lee, Hyunsu Hwang | 2023-12-26 |
| 11798872 | Interconnection structure and semiconductor package including the same | Jumyong Park, Jin Ho An, Dongjoon Oh, Jeonggi Jin, Hyunsu Hwang | 2023-10-24 |