Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417990 | Semiconductor device and method of fabricating the same | Woon Chun Kim, Dae Seo Park | 2025-09-16 |
| 12368093 | Semiconductor packages | Ju-Il Choi, Jin Ho An, Dongjoon Oh, Chungsun Lee, Jeonggi Jin +1 more | 2025-07-22 |
| 12347760 | Interconnection structure and semiconductor package including the same | Junyun Kweon, Jin Ho An, Dongjoon Oh, Jeonggi Jin, Hyunsu Hwang | 2025-07-01 |
| 12224256 | Wafer structure and semiconductor device | Hyunsu Hwang, Junyun Kweon, Solji Song, Dongjoon Oh, Chungsun Lee | 2025-02-11 |
| 12199056 | Semiconductor device, semiconductor package and method of manufacturing the same | Unbyoung Kang, Byeongchan KIM, Solji Song, Chungsun Lee | 2025-01-14 |
| 12142541 | Semiconductor package | Jeonggi Jin, Jinho An, Taehwa Jeong, Jinho Chun, Juil Choi +1 more | 2024-11-12 |
| 12027482 | Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip | Jeonggi Jin, Gyuho Kang, Unbyoung Kang, Heewon KIM, Hyunsu Hwang | 2024-07-02 |
| 12021034 | Semiconductor package and method of manufacturing the semiconductor package | Solji Song, Byeongchan KIM, Jinho An, Chungsun Lee, Jeonggi Jin +1 more | 2024-06-25 |
| 12009288 | Interconnection structure and semiconductor package including the same | Dongjoon Oh, Junyun Kweon, Jin Ho An, Chungsun Lee, Hyunsu Hwang | 2024-06-11 |
| 11996358 | Semiconductor packages having first and second redistribution patterns | Ju-Il Choi, Jin Ho An, Dongjoon Oh, Chungsun Lee, Jeonggi Jin +1 more | 2024-05-28 |
| 11978688 | Semiconductor device having via protective layer | Solji Song, Jinho An, Jeonggi Jin, Jinho Chun, Juil Choi | 2024-05-07 |
| 11923309 | Semiconductor package including fine redistribution patterns | Hyunsu Hwang, Junyun Kweon, Jin Ho An, Dongjoon Oh, Chungsun Lee +1 more | 2024-03-05 |
| 11854893 | Method of manufacturing semiconductor package | Junyun Kweon, Solji Song, Dongjoon Oh, Chungsun Lee, Hyunsu Hwang | 2023-12-26 |
| 11798872 | Interconnection structure and semiconductor package including the same | Junyun Kweon, Jin Ho An, Dongjoon Oh, Jeonggi Jin, Hyunsu Hwang | 2023-10-24 |
| 11637058 | Interconnection structure and semiconductor package including the same | Ju-Il Choi, Jin Ho An, Chungsun Lee, Teahwa Jeong, Jeonggi Jin | 2023-04-25 |
| 11476176 | Semiconductor device having via protective layer | Solji Song, Jinho An, Jeonggi Jin, Jinho Chun, Juil Choi | 2022-10-18 |
| 9502274 | Wafer loaders having buffer zones | Yi Koan Hong, Byung-Lyul Park, Jisoon Park, Kyu-Ha Lee, Siyoung Choi | 2016-11-22 |
| 9070748 | Semiconductor devices having through-vias and methods for fabricating the same | Pil-Kyu Kang, Taeyeong Kim, Byung-Lyul Park, Jinho Park, Kyu-Ha Lee +2 more | 2015-06-30 |