Issued Patents All Time
Showing 1–25 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014972 | Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices | Ju-Il Choi, Kwang-Jin Moon, Jin Ho An, Atsushi Fujisaki | 2024-06-18 |
| 11710715 | Semiconductor package | Joo-Hyung Lee, Ki-Tae Park, Joon Seok Oh, Jong-Ho Yun | 2023-07-25 |
| 11380636 | Semiconductor package | Seung Min BAEK, Yoon Su Kim, Seok Il HONG, Sung Ho Han | 2022-07-05 |
| 11094612 | Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices | Ju-Il Choi, Kwang-Jin Moon, Jin Ho An, Atsushi Fujisaki | 2021-08-17 |
| 10777487 | Integrated circuit device including through-silicon via structure and method of manufacturing the same | Ju-Il Choi, Kun-Sang Park, Son-Kwan Hwang, Ji-Soon Park | 2020-09-15 |
| 10770447 | Method for fabricating substrate structure and substrate structure fabricated by using the method | Ho-Jin Lee, Seok Ho Kim, Kwang-Jin Moon, Nae-In Lee | 2020-09-08 |
| 10651074 | Substrate processing apparatus and method of manufacture using the same | Kyoung Hwan Kim, TaeWoo Kang, Hyungjun Jeon | 2020-05-12 |
| 10401912 | Protection case for portable electronic device and method for determining state thereof | Seung Jai Lee, Bo Han | 2019-09-03 |
| 10325897 | Method for fabricating substrate structure and substrate structure fabricated by using the method | Ho-Jin Lee, Seok Ho Kim, Kwang-Jin Moon, Nae-In Lee | 2019-06-18 |
| 10325882 | Method of manufacturing semiconductor package | Tae Woo KANG, Kyoung Hwan Kim, Kun-Sang Park, Young-gyu Ahn | 2019-06-18 |
| 10199366 | Methods of manufacturing semiconductor packages | Seungwon Kim, Su Jin Kwon, Junwon Han, Hyunwoo KIM | 2019-02-05 |
| 10165349 | Audio output device and electronic device connected therewith | Kang Ho Park | 2018-12-25 |
| 10128168 | Integrated circuit device including through-silicon via structure and method of manufacturing the same | Ju-Il Choi, Kun-Sang Park, Son-Kwan Hwang, Ji-Soon Park | 2018-11-13 |
| 10103098 | Semiconductor devices including a through via structure and methods of forming the same | Deokyoung Jung, Kwangjin Moon, Jin Ho An | 2018-10-16 |
| 9935037 | Multi-stacked device having TSV structure | Pil-Kyu Kang, Ho-Jin Lee, Tae-Yeong Kim, Seok Ho Kim | 2018-04-03 |
| 9922897 | Method of manufacturing semiconductor package | Kyoung Hwan Kim, TaeWoo Kang, Hyungjun Jeon | 2018-03-20 |
| 9865581 | Method of fabricating multi-substrate semiconductor devices | Joo-Hee Jang, Pil-Kyu Kang, Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim +4 more | 2018-01-09 |
| 9859191 | Semiconductor device including conductive via with buffer layer at tapered portion of conductive via | Ho-Jin Lee, Jin Ho An | 2018-01-02 |
| 9852965 | Semiconductor devices with through electrodes and methods of fabricating the same | Ho-Jin Lee, Kwangjin Moon, Jisoon Park, Jin Ho An | 2017-12-26 |
| 9847276 | Semiconductor devices having through-electrodes and methods for fabricating the same | Pil-Kyu Kang, Sunghee KANG, Taeseong Kim, Taeyeong Kim, Kwangjin Moon +6 more | 2017-12-19 |
| 9831164 | Semiconductor device and method of fabricating the same | Kwang-Jin Moon, Pil-Kyu Kang, Dae-Lok Bae, Gil-Heyun Choi, Dong-Chan Lim +1 more | 2017-11-28 |
| 9824973 | Integrated circuit devices having through-silicon via structures and methods of manufacturing the same | Ho-Jin Lee, Jin Ho An | 2017-11-21 |
| 9773660 | Wafer processing methods | Tae-Yeong Kim, Pil-Kyu Kang, Jin-Ho Park | 2017-09-26 |
| 9728490 | Semiconductor devices and methods of manufacturing the same | Ju-Il Choi, Hyo Ju Kim, Yeun-Sang Park, Atsushi Fujisaki, Kwang-Jin Moon | 2017-08-08 |
| 9691685 | Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices | Kyu-Ha Lee, Hyung Jun Jeon, Jum-Yong Park, Ji-Soon Park, Jin Ho An +1 more | 2017-06-27 |