Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691684 | Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same | Jae-Hwa Park, Sung-Hee Kang, Kwang-Jin Moon, Suk-Chul Bang | 2017-06-27 |
| 9679829 | Semiconductor devices and methods of fabricating the same | Kwangjin Moon, Sunghee KANG, Taeseong Kim, Yeun-Sang Park, Sukchul Bang | 2017-06-13 |
| 9673133 | Semiconductor devices having through-electrodes | Jae-Hwa Park, Kwangjin Moon, Sukchul Bang | 2017-06-06 |
| 9653623 | Methods of manufacturing a semiconductor device | Yi Koan Hong, Yeun-Sang Park, Joo-Hee Jang | 2017-05-16 |
| 9653430 | Semiconductor devices having stacked structures and methods for fabricating the same | Taeyeong Kim, Seokho Kim, Pil-Kyu Kang, Hyoju Kim, Jin Ho An +1 more | 2017-05-16 |
| 9583373 | Wafer carrier having cavity | Ho-Jin Lee, Pil-Kyu Kang, Taeyeong Kim, Kyu-Ha Lee, Gilheyun Choi | 2017-02-28 |
| 9570377 | Semiconductor devices having through electrodes capped with self-aligned protection layers | Jeonggi Jin, Jisoon Park, Sukchul Bang, Deokyoung Jung | 2017-02-14 |
| 9543200 | Methods for fabricating semiconductor devices having through electrodes | Kunsang Park, Sukyoung Kim, Jisoon Park, Ju-Il Choi, Gilheyun Choi | 2017-01-10 |
| 9543250 | Semiconductor devices including through-silicon via | Jin Ho An, Soyoung Lee, Gilheyun Choi | 2017-01-10 |
| 9530706 | Semiconductor devices having hybrid stacking structures and methods of fabricating the same | Pil-Kyu Kang, Taeyeong Kim, Yeun-Sang Park, Dosun Lee, Ho-Jin Lee +3 more | 2016-12-27 |
| 9520361 | Semiconductor devices | Pil-Kyu Kang, Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Joo-Hee Jang +1 more | 2016-12-13 |
| 9502274 | Wafer loaders having buffer zones | Yi Koan Hong, Jumyong Park, Jisoon Park, Kyu-Ha Lee, Siyoung Choi | 2016-11-22 |
| 9496218 | Integrated circuit device having through-silicon-via structure | Do-Sun Lee, Kun-Sang Park, Seong Min Son, Gil-Heyun Choi | 2016-11-15 |
| 9496163 | Carrier and method of fabricating semiconductor device using the same | Hyungjun Jeon, Jisoon Park | 2016-11-15 |
| 9490216 | Semiconductor device and semiconductor package | Kwang-Jin Moon, Tae-Seong Kim, Jae-Hwa Park, Suk-Chul Bang | 2016-11-08 |
| 9461007 | Wafer-to-wafer bonding structure | Jin-ho Chun, Pil-Kyu Kang, Jae-Hwa Park, Ju-Il Choi | 2016-10-04 |
| 9431341 | Semiconductor device having metal patterns and piezoelectric patterns | Yi Koan Hong, Ji-Soon Park, Si-Young Choi | 2016-08-30 |
| 9379042 | Integrated circuit devices having through silicon via structures and methods of manufacturing the same | Jae-Hwa Park, Suk-Chul Bang, Kwang-Jin Moon | 2016-06-28 |
| 9362172 | Semiconductor devices having through-vias and methods for fabricating the same | Kyu-Ha Lee, Ho-Jin Lee, Pil-Kyu Kang, Hyunsoo Chung, Gilheyun Choi | 2016-06-07 |
| 9337125 | Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure | Jae-Hwa Park, Kwang-Jin Moon | 2016-05-10 |
| 9287251 | Method of manufacturing a semiconductor device | Pil-Kyu Kang, Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Yeun-Sang Park +4 more | 2016-03-15 |
| 9252141 | Semiconductor integrated circuit, method for fabricating the same, and semiconductor package | Kwang-Jin Moon, Jae-Hwa Park | 2016-02-02 |
| 9236349 | Semiconductor device including through via structures and redistribution structures | Kyu-Ha Lee, Pil-Kyu Kang, Tae-Yeong Kim, Ho-Jin Lee, Gil-Heyun Choi | 2016-01-12 |
| 9171753 | Semiconductor devices having conductive via structures and methods for fabricating the same | Ho-Jin Lee, Kyu-Ha Lee, Gilheyun Choi, YongSoon Choi, Pil-Kyu Kang +1 more | 2015-10-27 |
| 9153489 | Microelectronic devices having conductive through via electrodes insulated by gap regions | Ho-Jin Lee, SeYoung Jeong, Hyunsoo Chung, Gilheyun Choi | 2015-10-06 |