Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136602 | Method of fabricating a semiconductor device | Ju-Il Choi, Hoechul Kim, Hoonjoo Na, Jaehyung Park, Seongmin Son | 2024-11-05 |
| 11901356 | Three-dimensional semiconductor devices | Seungha Oh, Kughwan Kim, Weonhong Kim, Yuichiro Sasaki, Sang-Woo Lee +3 more | 2024-02-13 |
| 11610838 | Semiconductor device | Yuichiro Sasaki, Sungkeun Lim, Weonhong Kim, Seungha Oh, Yongho Ha +1 more | 2023-03-21 |
| 11283235 | Semiconductor laser device | Seok Ho Kim, Tae-Yeong Kim, Hoe Chul Kim, Hoon-Joo Na | 2022-03-22 |
| 11152317 | Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same | Ju-Il Choi, Hoechul Kim, Hoonjoo Na, Jaehyung Park, Seongmin Son | 2021-10-19 |
| 11121080 | Semiconductor device | Yuichiro Sasaki, Sungkeun Lim, Weonhong Kim, Seungha Oh, Yongho Ha +1 more | 2021-09-14 |
| 10639875 | Wafer bonding apparatus and wafer bonding system including the same | Tae-Yeong Kim, Seok Ho Kim, Kwang-Jin Moon, Na-ein Lee, Ho-Jin Lee | 2020-05-05 |
| 10468400 | Method of manufacturing substrate structure | Seok Ho Kim, Tae-Yeong Kim, Kwang-Jin Moon, Ho-Jin Lee | 2019-11-05 |
| 9941243 | Wafer-to-wafer bonding structure | Tae-Yeong Kim, Seok Ho Kim, Kwang-Jin Moon, Ho-Jin Lee | 2018-04-10 |
| 9935037 | Multi-stacked device having TSV structure | Ho-Jin Lee, Byung-Lyul Park, Tae-Yeong Kim, Seok Ho Kim | 2018-04-03 |
| 9865581 | Method of fabricating multi-substrate semiconductor devices | Joo-Hee Jang, Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Byung-Lyul Park +4 more | 2018-01-09 |
| 9847276 | Semiconductor devices having through-electrodes and methods for fabricating the same | Byung-Lyul Park, Sunghee KANG, Taeseong Kim, Taeyeong Kim, Kwangjin Moon +6 more | 2017-12-19 |
| 9831164 | Semiconductor device and method of fabricating the same | Kwang-Jin Moon, Dae-Lok Bae, Gil-Heyun Choi, Byung-Lyul Park, Dong-Chan Lim +1 more | 2017-11-28 |
| 9773660 | Wafer processing methods | Tae-Yeong Kim, Byung-Lyul Park, Jin-Ho Park | 2017-09-26 |
| 9653430 | Semiconductor devices having stacked structures and methods for fabricating the same | Taeyeong Kim, Byung-Lyul Park, Seokho Kim, Hyoju Kim, Jin Ho An +1 more | 2017-05-16 |
| 9583373 | Wafer carrier having cavity | Ho-Jin Lee, Taeyeong Kim, Byung-Lyul Park, Kyu-Ha Lee, Gilheyun Choi | 2017-02-28 |
| 9530706 | Semiconductor devices having hybrid stacking structures and methods of fabricating the same | Byung-Lyul Park, Taeyeong Kim, Yeun-Sang Park, Dosun Lee, Ho-Jin Lee +3 more | 2016-12-27 |
| 9530726 | Semiconductor device and method of fabricating the same | Kwang-Jin Moon, Byung-Iyul Park, Dong-Chan Lim, Deok-Young Jung, Gil-Heyun Choi +1 more | 2016-12-27 |
| 9520361 | Semiconductor devices | Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Byung-Lyul Park, Joo-Hee Jang +1 more | 2016-12-13 |
| 9461007 | Wafer-to-wafer bonding structure | Jin-ho Chun, Byung-Lyul Park, Jae-Hwa Park, Ju-Il Choi | 2016-10-04 |
| 9362172 | Semiconductor devices having through-vias and methods for fabricating the same | Kyu-Ha Lee, Ho-Jin Lee, Byung-Lyul Park, Hyunsoo Chung, Gilheyun Choi | 2016-06-07 |
| 9312171 | Semiconductor devices having through-electrodes and methods for fabricating the same | Kyu-Hee Han, Taejin Yim, Naein Lee | 2016-04-12 |
| 9287251 | Method of manufacturing a semiconductor device | Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Byung-Lyul Park, Yeun-Sang Park +4 more | 2016-03-15 |
| 9236349 | Semiconductor device including through via structures and redistribution structures | Kyu-Ha Lee, Tae-Yeong Kim, Ho-Jin Lee, Byung-Lyul Park, Gil-Heyun Choi | 2016-01-12 |
| 9171753 | Semiconductor devices having conductive via structures and methods for fabricating the same | Ho-Jin Lee, Kyu-Ha Lee, Gilheyun Choi, YongSoon Choi, Byung-Lyul Park +1 more | 2015-10-27 |