Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224262 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the same | Taeyeong Kim, Ilyoung Han | 2025-02-11 |
| 12136602 | Method of fabricating a semiconductor device | Ju-Il Choi, Pil-Kyu Kang, Hoonjoo Na, Jaehyung Park, Seongmin Son | 2024-11-05 |
| 11990444 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the same | Taeyeong Kim, Ilyoung Han | 2024-05-21 |
| 11728197 | Wafer to wafer bonding apparatus and wafer to wafer bonding method | Jaehyun PHEE, Seokho Kim, Taeyeong Kim, Hoonjoo Na | 2023-08-15 |
| 11721562 | Substrate bonding apparatus | Hyungjun Jeon, Taeyeong Kim, Junhong Min | 2023-08-08 |
| 11594443 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus | Taeyeong Kim, Hakjun Lee, Hoonjoo Na | 2023-02-28 |
| 11152317 | Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same | Ju-Il Choi, Pil-Kyu Kang, Hoonjoo Na, Jaehyung Park, Seongmin Son | 2021-10-19 |
| 10923452 | Substrate bonding apparatus | Ilyoung Han, Taeyeong Kim, Jihoon Kang, Nohsung Kwak, Seokho Kim +2 more | 2021-02-16 |