Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237293 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof | Hiroyuki Amano, Yuki Antoku, Takeshi Kuwahara, Tsukasa ICHIKAWA, Osamu Matsuzawa | 2025-02-25 |
| 12224328 | Semiconductor device having word line structure | Cheng Ji | 2025-02-11 |
| 11937420 | Memory device having word line with improved adhesion between work function member and conductive layer | Yueh Hsu | 2024-03-19 |
| 11903180 | Method of manufacturing semiconductor device having word line structure | Cheng Ji | 2024-02-13 |
| 11895820 | Method of manufacturing memory device having word line with improved adhesion between work function member and conductive layer | Yueh Hsu | 2024-02-06 |
| 10195697 | Palladium (Pd)-coated copper wire for ball bonding | Hiroyuki Amano, Somei Yarita, Yusuke SAKITA, Yuki Antoku | 2019-02-05 |
| 9972595 | Bonding wire for high-speed signal line | Yuki Antoku, Kazuhiko Yasuhara, Jun Chiba, Junichi OKAZAKI, Nanako Maeda | 2018-05-15 |
| 9362249 | Silver—gold alloy bonding wire | Kazuhiko Yasuhara, Nanako Maeda, Junichi OKAZAKI, Jun Chiba, Yuki Antoku | 2016-06-07 |