Wei CHEN — 8 Patents at Nanya Technology

Wei CHEN has been granted 8 US patents while listed as an inventor at Nanya Technology. The first was granted in 2016 and the most recent in February 2025. Wei CHEN ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Wei CHEN in Saga, JP.

Patents per Year

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date
12237293	Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof	Hiroyuki Amano, Yuki Antoku, Takeshi Kuwahara, Tsukasa ICHIKAWA, Osamu Matsuzawa	2025-02-25
12224328	Semiconductor device having word line structure	Cheng Ji	2025-02-11
11937420	Memory device having word line with improved adhesion between work function member and conductive layer	Yueh Hsu	2024-03-19
11903180	Method of manufacturing semiconductor device having word line structure	Cheng Ji	2024-02-13
11895820	Method of manufacturing memory device having word line with improved adhesion between work function member and conductive layer	Yueh Hsu	2024-02-06
10195697	Palladium (Pd)-coated copper wire for ball bonding	Hiroyuki Amano, Somei Yarita, Yusuke SAKITA, Yuki Antoku	2019-02-05
9972595	Bonding wire for high-speed signal line	Yuki Antoku, Kazuhiko Yasuhara, Jun Chiba, Junichi OKAZAKI, Nanako Maeda	2018-05-15
9362249	Silver—gold alloy bonding wire	Kazuhiko Yasuhara, Nanako Maeda, Junichi OKAZAKI, Jun Chiba, Yuki Antoku	2016-06-07

Wei CHEN — 8 Patents

Patents per Year

Issued Patents All Time

Patent Widget