Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10195697 | Palladium (Pd)-coated copper wire for ball bonding | Hiroyuki Amano, Yusuke SAKITA, Yuki Antoku, Wei CHEN | 2019-02-05 |
| 6875324 | Sputtering target material | Noriaki Hara, Ken Hagiwara, Ritsuya Matsuzaka | 2005-04-05 |
| 6309529 | Method for producing sputtering target material | Noriaki Hara, Ken Hagiwara, Ritsuya Matsuzaka | 2001-10-30 |