Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237293 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof | Hiroyuki Amano, Takeshi Kuwahara, Tsukasa ICHIKAWA, Osamu Matsuzawa, Wei CHEN | 2025-02-25 |
| 12087724 | Palladium-coated copper bonding wire and method for manufacturing same | Hiroyuki Amano, Takeshi Kuwahara | 2024-09-10 |
| 11876066 | Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device | Hiroyuki Amano, Takeshi Kuwahara, Tsukasa ICHIKAWA | 2024-01-16 |
| 11456271 | Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same | Jun Chiba, Shota Kawano | 2022-09-27 |
| 11289442 | Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereof | Shota Kawano, Yusuke SAKITA | 2022-03-29 |
| 11251153 | Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bonding | Jun Chiba, Shota Kawano | 2022-02-15 |
| 10195697 | Palladium (Pd)-coated copper wire for ball bonding | Hiroyuki Amano, Somei Yarita, Yusuke SAKITA, Wei CHEN | 2019-02-05 |
| 9972595 | Bonding wire for high-speed signal line | Kazuhiko Yasuhara, Jun Chiba, Wei CHEN, Junichi OKAZAKI, Nanako Maeda | 2018-05-15 |
| 9362249 | Silver—gold alloy bonding wire | Kazuhiko Yasuhara, Nanako Maeda, Junichi OKAZAKI, Jun Chiba, Wei CHEN | 2016-06-07 |
| 9103001 | Ag—Au—Pd ternary alloy bonding wire | Jun Chiba, Satoshi Teshima, Tasuku Kobayashi | 2015-08-11 |