Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237293 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof | Hiroyuki Amano, Yuki Antoku, Takeshi Kuwahara, Osamu Matsuzawa, Wei CHEN | 2025-02-25 |
| 11876066 | Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device | Hiroyuki Amano, Yuki Antoku, Takeshi Kuwahara | 2024-01-16 |