OM

Osamu Matsuzawa

SI Seiko Instruments: 3 patents #474 of 1,437Top 35%
TK Tanaka Kikinzoku Kogyo K.K.: 3 patents #94 of 436Top 25%
HS Hitachi High-Tech Science: 2 patents #65 of 167Top 40%
TK Tanaka Denshi Kogyo K. K.: 2 patents #9 of 31Top 30%
SC Sankyo Seiki Mfg. Co.: 1 patents #107 of 244Top 45%
Overall (All Time): #478,856 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
12237293 Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof Hiroyuki Amano, Yuki Antoku, Takeshi Kuwahara, Tsukasa ICHIKAWA, Wei CHEN 2025-02-25
11996382 Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof Mitsuo Takada, Nanako Maeda, Ryo Ishikawa, Takuya Kobayashi 2024-05-28
9500524 ICP emission spectrometer 2016-11-22
8859279 Cell detachment method Amiko Nihei, Masatsugu Shigeno, Yoshiharu Shirakawabe, Akira Inoue, Naoya Watanabe 2014-10-14
7823470 Cantilever and cantilever manufacturing method Masatsugu Shigeno, Naoya Watanabe, Amiko Nihei, Akira Inoue, Yoshiharu Shirakawabe +2 more 2010-11-02
7456400 Scanning probe microscope and scanning method Masatsugu Shigeno, Yoshiharu Shirakawabe, Amiko Nihei, Naoya Watanabe, Akira Inoue 2008-11-25
6514630 Au-based clad composite material, producing method thereof and micromotor using the same Mii Matsuzawa, Hirotaka Sakamaki 2003-02-04
6432157 Method for preparing Ag-ZnO electric contact material and electric contact material produced thereby Tetsuya Nakamura, Osamu Sakaguchi, Hiroyuki Kusamori, Masahiro Takahashi, Toshiya Yamamoto 2002-08-13
6002129 Inductively coupled plasma mass spectrometric and spectrochemical analyzer Tetsumasa Ito, Yoshitomo Nakagawa 1999-12-14
5531371 Process of preparing clad contact material 1996-07-02