Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996382 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof | Mitsuo Takada, Osamu Matsuzawa, Ryo Ishikawa, Takuya Kobayashi | 2024-05-28 |
| 9972595 | Bonding wire for high-speed signal line | Yuki Antoku, Kazuhiko Yasuhara, Jun Chiba, Wei CHEN, Junichi OKAZAKI | 2018-05-15 |
| 9362249 | Silver—gold alloy bonding wire | Kazuhiko Yasuhara, Junichi OKAZAKI, Jun Chiba, Wei CHEN, Yuki Antoku | 2016-06-07 |