Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972595 | Bonding wire for high-speed signal line | Yuki Antoku, Jun Chiba, Wei CHEN, Junichi OKAZAKI, Nanako Maeda | 2018-05-15 |
| 9362249 | Silver—gold alloy bonding wire | Nanako Maeda, Junichi OKAZAKI, Jun Chiba, Wei CHEN, Yuki Antoku | 2016-06-07 |