Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728197 | Wafer to wafer bonding apparatus and wafer to wafer bonding method | Hoechul Kim, Seokho Kim, Taeyeong Kim, Hoonjoo Na | 2023-08-15 |
JP
Jaehyun PHEE
Overall (All Time): #2,600,213 of 4,157,543Top 65%
1
Patents All Time