Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347768 | Semiconductor device including via structure | Anthony Dongick LEE, Sangcheol Na, Kichul Park, Doohwan PARK, Kyoungwoo Lee +5 more | 2025-07-01 |
| 12334477 | Semiconductor packages | Jinnam Kim, Seokho Kim, Kwangjin Moon | 2025-06-17 |
| 12317572 | Semiconductor device | Wonkeun Chung, Byungchul Kang, Hongkeun Park, Chunghwan Shin | 2025-05-27 |
| 12300671 | Semiconductor packages and methods of manufacturing the semiconductor packages | Eunsuk Jung, Hyoukyung Cho, Jinnam Kim, Hyungjun Jeon, Kwangjin Moon +1 more | 2025-05-13 |
| 12167596 | Three-dimensional semiconductor devices and method of manufacturing the same | Seungha Oh, Weonhong Kim | 2024-12-10 |
| 12166000 | Semiconductor device including a lower chip including a peripheral circuit and first and second memory chips vertically stacked thereon and data storage system including the same | Jungseob SO, Taeseong Kim, Sohye CHO, Sonkwan HWANG | 2024-12-10 |
| 12142588 | Semiconductor device and method of manufacturing the same | Joohee Jang, Seokho Kim, Jaehyung Park, Kyuha Lee | 2024-11-12 |
| 12136602 | Method of fabricating a semiconductor device | Ju-Il Choi, Pil-Kyu Kang, Hoechul Kim, Jaehyung Park, Seongmin Son | 2024-11-05 |
| 12046538 | Semiconductor device including through via structure | Sonkwan HWANG, Taeseong Kim, Kwangjin Moon, Hyungjun Jeon | 2024-07-23 |
| 12021080 | Semiconductor device and method of manufacturing the same | Dongsoo Lee, Wonkeun Chung, Suyoung Bae, Jaeyeol Song, Jonghan Lee +2 more | 2024-06-25 |
| 11887966 | Semiconductor packages | Jinnam Kim, Seokho Kim, Kwangjin Moon | 2024-01-30 |
| 11887841 | Semiconductor packages | Kyuha Lee, Joohee Jang, Seokho Kim, Jaehyung Park, Seongmin Son +1 more | 2024-01-30 |
| 11824035 | Method of manufacturing a semiconductor device including bonding layer and adsorption layer | Jaehyung Park, Seokho Kim, Kwangjin Moon, Kyuha Lee, Joohee Jang | 2023-11-21 |
| 11810900 | Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages | Eunsuk Jung, Hyoukyung Cho, Jinnam Kim, Hyungjun Jeon, Kwangjin Moon +1 more | 2023-11-07 |
| 11749587 | Semiconductor device | Jinnam Kim, Seokho Kim, Kwangjin Moon | 2023-09-05 |
| 11749586 | Semiconductor device including through via structure | Sonkwan HWANG, Taeseong Kim, Kwangjin Moon, Hyungjun Jeon | 2023-09-05 |
| 11742351 | Semiconductor device and method of manufacturing the same | Dongsoo Lee, Wonkeun Chung, Suyoung Bae, Jaeyeol Song, Jonghan Lee +2 more | 2023-08-29 |
| 11728197 | Wafer to wafer bonding apparatus and wafer to wafer bonding method | Jaehyun PHEE, Hoechul Kim, Seokho Kim, Taeyeong Kim | 2023-08-15 |
| 11721628 | Semiconductor device | Jinnam Kim, Kwangjin Moon, Hojin Lee, Pilkyu Kang | 2023-08-08 |
| RE49538 | Semiconductor device and method of fabricating the same | Sangjin Hyun, Yugyun Shin, Hongbae Park, Sughun Hong, Hye-Lan Lee +1 more | 2023-05-30 |
| 11658139 | Semiconductor package for improving bonding reliability | Jaehyung Park, Seokho Kim, Seongmin Son, Kyuha Lee, Yikoan Hong | 2023-05-23 |
| 11616036 | Semiconductor device and method of manufacturing the same | Joohee Jang, Seokho Kim, Jaehyung Park, Kyuha Lee | 2023-03-28 |
| 11594443 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus | Hoechul Kim, Taeyeong Kim, Hakjun Lee | 2023-02-28 |
| 11552096 | Three-dimensional semiconductor devices and method of manufacturing the same | Seungha Oh, Weonhong Kim | 2023-01-10 |
| 11380607 | Semiconductor device | Jinnam Kim, Seokho Kim, Kwangjin Moon | 2022-07-05 |