Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347781 | Semiconductor devices having penetration vias | Hakseung Lee, Jinnam Kim, Taeseong Kim, Kwangjin Moon | 2025-07-01 |
| 12300671 | Semiconductor packages and methods of manufacturing the semiconductor packages | Eunsuk Jung, Jinnam Kim, Hyungjun Jeon, Kwangjin Moon, Hoonjoo Na +1 more | 2025-05-13 |
| 11961788 | Semiconductor device including through-electrodes | Hojin Lee, Kwangjin Moon | 2024-04-16 |
| 11810900 | Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages | Eunsuk Jung, Jinnam Kim, Hyungjun Jeon, Kwangjin Moon, Hoonjoo Na +1 more | 2023-11-07 |
| 11804419 | Semiconductor device | Hakseung Lee, Kwangjin Moon, Hyungjun Jeon | 2023-10-31 |
| 11694980 | Semiconductor stack and method for manufacturing the same | Hyungjun Jeon, Kwangjin Moon, Hakseung Lee | 2023-07-04 |
| 11664316 | Semiconductor devices having penetration vias with portions having decreasing widths | Hakseung Lee, Jinnam Kim, Taeseong Kim, Kwangjin Moon | 2023-05-30 |
| 11373932 | Semiconductor packages including through holes and methods of fabricating the same | Daesuk Lee, Jinnam Kim, Taeseong Kim, Kwangjin Moon, Hakseung Lee | 2022-06-28 |
| 11315894 | Semiconductor stack and method for manufacturing the same | Hyungjun Jeon, Kwangjin Moon, Hakseung Lee | 2022-04-26 |