Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798866 | Semiconductor device including via structures with undercut portions and semiconductor package including the same | Eunji Kim, Sungdong Cho, Kwangwuk Park, Sangjun Park, Hakseung Lee | 2023-10-24 |
| 11380606 | Semiconductor device including via structure with head and body portions | Eunji Kim, Sungdong Cho, Kwangwuk Park, Sangjun Park, Hakseung Lee | 2022-07-05 |
| 11373932 | Semiconductor packages including through holes and methods of fabricating the same | Hyoukyung Cho, Jinnam Kim, Taeseong Kim, Kwangjin Moon, Hakseung Lee | 2022-06-28 |