Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334438 | Semiconductor device | Minsung Kang, Hyoungyol Mun, Wonhee Cho | 2025-06-17 |
| 12183680 | Semiconductor memory device including wiring contact plugs | Yonghyeok Son, Junwoo Lee | 2024-12-31 |
| 12176245 | Semiconductor chip structure | Sangjun Park, Byungkyu Kim, Eunji Kim, Seungwoo Paek | 2024-12-24 |
| 12096319 | Method by which first device transmits message in wireless communication system supporting sidelink, and device therefor | Hakseong Kim, Myoungseob Kim, Jaeho Hwang | 2024-09-17 |
| 11990450 | Device including first structure having peripheral circuit and second structure having gate layers | Eunji Kim, Seungwoo Paek, Byungkyu Kim, Sangjun Park | 2024-05-21 |
| 11901297 | Semiconductor memory device including wiring contact plugs | Yonghyeok Son, Junwoo Lee | 2024-02-13 |
| 11848285 | Semiconductor chip including buried dielectric pattern at edge region, semiconductor package including the same, and method of fabricating the same | Kwangwuk Park, Youngmin Lee, Inyoung Lee | 2023-12-19 |
| 11832184 | System and method for exchanging data or signals for vehicle | Donghwi Kim, Hakseong Kim, Min Su Song | 2023-11-28 |
| 11798866 | Semiconductor device including via structures with undercut portions and semiconductor package including the same | Eunji Kim, Kwangwuk Park, Sangjun Park, Daesuk Lee, Hakseung Lee | 2023-10-24 |
| 11791242 | Semiconductor device | Kwangwuk Park, Youngmin Lee, Hyoungyol Mun, Inyoung Lee, Seokhwan Jeong | 2023-10-17 |
| 11735498 | Through via electrode and device isolation structure including oxide layer pattern and nitride layer pattern sequentially stacked on inner surface of trench | Kwangwuk Park, Youngmin Lee, Eunji Kim, Hyoungyol Mun, Seokhwan Jeong | 2023-08-22 |
| 11705379 | Semiconductor packages | Chanho Lee, Won Keun Kim, Haeseok Park, Ilgeun Jung, Jinkuk Bae +1 more | 2023-07-18 |
| 11569171 | Semiconductor memory device including wiring contact plugs | Yonghyeok Son, Junwoo Lee | 2023-01-31 |
| 11380606 | Semiconductor device including via structure with head and body portions | Eunji Kim, Kwangwuk Park, Sangjun Park, Daesuk Lee, Hakseung Lee | 2022-07-05 |