| 12347781 |
Semiconductor devices having penetration vias |
Jinnam Kim, Hyoukyung Cho, Taeseong Kim, Kwangjin Moon |
2025-07-01 |
| 12300671 |
Semiconductor packages and methods of manufacturing the semiconductor packages |
Eunsuk Jung, Hyoukyung Cho, Jinnam Kim, Hyungjun Jeon, Kwangjin Moon +1 more |
2025-05-13 |
| 11810900 |
Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages |
Eunsuk Jung, Hyoukyung Cho, Jinnam Kim, Hyungjun Jeon, Kwangjin Moon +1 more |
2023-11-07 |
| 11804419 |
Semiconductor device |
Kwangjin Moon, Hyungjun Jeon, Hyoukyung Cho |
2023-10-31 |
| 11798866 |
Semiconductor device including via structures with undercut portions and semiconductor package including the same |
Eunji Kim, Sungdong Cho, Kwangwuk Park, Sangjun Park, Daesuk Lee |
2023-10-24 |
| 11791137 |
Apparatus for etching substrate bevel and semiconductor fabrication method using the same |
Ho-Jin Lee, Dong-Chan Lim, Jinnam Kim, Kwangjin Moon |
2023-10-17 |
| 11694980 |
Semiconductor stack and method for manufacturing the same |
Hyungjun Jeon, Kwangjin Moon, Hyoukyung Cho |
2023-07-04 |
| 11664316 |
Semiconductor devices having penetration vias with portions having decreasing widths |
Jinnam Kim, Hyoukyung Cho, Taeseong Kim, Kwangjin Moon |
2023-05-30 |
| 11380606 |
Semiconductor device including via structure with head and body portions |
Eunji Kim, Sungdong Cho, Kwangwuk Park, Sangjun Park, Daesuk Lee |
2022-07-05 |
| 11373932 |
Semiconductor packages including through holes and methods of fabricating the same |
Hyoukyung Cho, Daesuk Lee, Jinnam Kim, Taeseong Kim, Kwangjin Moon |
2022-06-28 |
| 11315894 |
Semiconductor stack and method for manufacturing the same |
Hyungjun Jeon, Kwangjin Moon, Hyoukyung Cho |
2022-04-26 |
| 11133240 |
Semiconductor device and semiconductor package |
Jinnam Kim, Kwangjin Moon, Eunji Kim, Taeseong Kim, Sangjun Park |
2021-09-28 |
