Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224262 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the same | Taeyeong Kim, Hoechul Kim | 2025-02-11 |
| 11990444 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the same | Taeyeong Kim, Hoechul Kim | 2024-05-21 |
| 11984345 | Substrate processing apparatus and driving method thereof | Hunyong Park, Sohee Han, Nohsung Kwak | 2024-05-14 |
| 11942344 | Method of determining a critical temperature of a semiconductor package and apparatus for performing the same | Mingi Hong, Choongbo Shim, Heejin Kim, Nungpyo Hong | 2024-03-26 |
| 11651990 | Substrate processing apparatus and driving method thereof | Hunyong Park, Sohee Han, Nohsung Kwak | 2023-05-16 |
| 11581202 | Substrate debonding apparatus | Kyoungran Kim, Chulhyun Park, Minjae Shin, Geunsik Oh, Hyunjin Lee +2 more | 2023-02-14 |
| 11462410 | Semiconductor manufacturing apparatus including a beam shaper for shaping a laser beam | Nohsung Kwak, Euijin Seo, Jonghwi Seo, Jaehee Lee, Guesuk Lee | 2022-10-04 |
| 11430679 | Semiconductor manufacturing apparatus | Kwangnam Kim, Nohsung Kwak, Sungyeon KIM, Hyungjun Kim, Haejoong Park +3 more | 2022-08-30 |
| 10923452 | Substrate bonding apparatus | Taeyeong Kim, Jihoon Kang, Nohsung Kwak, Seokho Kim, Hoechul Kim +2 more | 2021-02-16 |
| 9640507 | Bonding method, bonding apparatus, and method for manufacturing substrate | Kyoungran Kim, Donggil Shim, Youngjoo Lee, Byunggon Kim, Byeongkap Choi | 2017-05-02 |
| 9553069 | Bonding apparatus and substrate manufacturing equipment including the same | Kyoungran Kim, Donggil Shim, Geunsik Oh, Youngjoo Lee, Junho Lee +1 more | 2017-01-24 |
| 9245787 | Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same | Chang-Seong Jeon, Sangwook Park, Teakhoon Lee | 2016-01-26 |