Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12355004 | Semiconductor chip and semiconductor package | Junyeong Heo, Yeongkwon Ko, Unbyoung Kang | 2025-07-08 |
| 12237240 | Semiconductor package and method of manufacturing semiconductor package | Jinwoo Park, Jongho Lee, Yeongkwon Ko | 2025-02-25 |
| 12218096 | Semiconductor package and method of forming the same | Yeongkwon Ko, Unbyoung Kang, Soyeon Kwon, Yoonsung Kim | 2025-02-04 |
| 12176313 | Semiconductor package | Hyoungjoo Lee, Unbyoung Kang, Sechul Park, Sangsick Park, Hyojin Yun +1 more | 2024-12-24 |
| 11967581 | Package structures having underfills | Jinwoo Park, Unbyoung Kang, Jongho Lee | 2024-04-23 |
| 11923340 | Semiconductor package including mold layer and manufacturing method thereof | Yeongkwon Ko, Jinwoo Park, Jaekyung Yoo | 2024-03-05 |
| 11791308 | Semiconductor package | Jihwan Hwang, Unbyoung Kang, Sangsick Park, Jihwan Suh, Soyoun Lee | 2023-10-17 |
| 11791282 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Jaekyung Yoo, Yeongkwon Ko, Jayeon LEE, Jaeeun Lee | 2023-10-17 |
| 11705323 | Wafer trimming device | Jungseok Ahn, Unbyoung Kang, Chungsun Lee | 2023-07-18 |
| 11587906 | Package structures having underfills | Jinwoo Park, Unbyoung Kang, Jongho Lee | 2023-02-21 |
| 11462462 | Semiconductor packages including a recessed conductive post | Jaekyung Yoo, Jaeeun Lee, Yeongkwon Ko | 2022-10-04 |
| 11362062 | Semiconductor package | Jihwan Hwang, Unbyoung Kang, Sangsick Park, Jihwan Suh, Soyoun Lee | 2022-06-14 |
| 9245787 | Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same | Chang-Seong Jeon, Sangwook Park, Ilyoung Han | 2016-01-26 |