Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406888 | Semiconductor substrate and method of dicing the same | Donghoon Won, Jaeeun Lee, Junyeong Heo | 2025-09-02 |
| 12362328 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Jin-Woo Park, Teak-Hoon Lee | 2025-07-15 |
| 12355004 | Semiconductor chip and semiconductor package | Junyeong Heo, Unbyoung Kang, Teakhoon Lee | 2025-07-08 |
| 12237240 | Semiconductor package and method of manufacturing semiconductor package | Jinwoo Park, Jongho Lee, Teakhoon Lee | 2025-02-25 |
| 12218096 | Semiconductor package and method of forming the same | Unbyoung Kang, Soyeon Kwon, Yoonsung Kim, Teakhoon Lee | 2025-02-04 |
| 12165991 | Semiconductor package | Un-Byoung Kang, Jaekyung Yoo, Teak-Hoon Lee | 2024-12-10 |
| 12094794 | Semiconductor package and method of fabricating the same | Seunghun Shin, Junyeong Heo | 2024-09-17 |
| 12062639 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jongho Lee | 2024-08-13 |
| 12002726 | Semiconductor package and method of manufacture | Jinwoo Park, Jongho Lee | 2024-06-04 |
| 11996367 | Semiconductor device and semiconductor package including the same | Jaeeun Lee, Junyeong Heo | 2024-05-28 |
| 11923343 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Jin-Woo Park, Teak-Hoon Lee | 2024-03-05 |
| 11923340 | Semiconductor package including mold layer and manufacturing method thereof | Jinwoo Park, Jaekyung Yoo, Teakhoon Lee | 2024-03-05 |
| 11869821 | Semiconductor package having molding layer with inclined side wall | Seunghun Shin, Junyeong Heo | 2024-01-09 |
| 11791282 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Jaekyung Yoo, Jayeon LEE, Jaeeun Lee, Teakhoon Lee | 2023-10-17 |
| 11721669 | Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widths | Junyeong Heo, Jae Eun Lee, Donghoon Won | 2023-08-08 |
| 11694963 | Semiconductor device and semiconductor package including the same | Jaeeun Lee, Junyeong Heo | 2023-07-04 |
| 11610828 | Semiconductor package and method of manufacture | Jinwoo Park, Jongho Lee | 2023-03-21 |
| 11594499 | Semiconductor package | Un-Byoung Kang, Jaekyung Yoo, Teak-Hoon Lee | 2023-02-28 |
| 11538792 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Jin-Woo Park, Teak-Hoon Lee | 2022-12-27 |
| 11515226 | Semiconductor package and method of fabricating the same | Seunghun Shin, Junyeong Heo | 2022-11-29 |
| 11462462 | Semiconductor packages including a recessed conductive post | Jaekyung Yoo, Jaeeun Lee, Teakhoon Lee | 2022-10-04 |
| 11424172 | Semiconductor package | Seunghun Shin, Junyeong Heo | 2022-08-23 |
| 11239171 | Semiconductor device and semiconductor package including the same | Jaeeun Lee, Junyeong Heo | 2022-02-01 |