Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400980 | Semiconductor package | Sunkyoung Seo, Chajea Jo | 2025-08-26 |
| 12362328 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park | 2025-07-15 |
| 12165991 | Semiconductor package | Yeongkwon Ko, Un-Byoung Kang, Jaekyung Yoo | 2024-12-10 |
| 12113050 | Semiconductor package with increased thermal radiation efficiency | Sang-Sick Park, Un-Byoung Kang, Jongho Lee | 2024-10-08 |
| 12074141 | Semiconductor package | Seung-Hun Shin, Un-Byoung Kang, Yeong Kwon Ko, Jong Ho Lee, Jun Yeong Heo | 2024-08-27 |
| 11923343 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park | 2024-03-05 |
| 11848293 | Semiconductor package | Sunkyoung Seo, Chajea Jo | 2023-12-19 |
| 11594499 | Semiconductor package | Yeongkwon Ko, Un-Byoung Kang, Jaekyung Yoo | 2023-02-28 |
| 11538792 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park | 2022-12-27 |
| 10930613 | Semiconductor package having recessed adhesive layer between stacked chips | Sang-Sick Park, Un-Byoung Kang, Tae Hong Min, Ji Hwan Hwang | 2021-02-23 |
| 10867857 | Method of cutting substrate and method of singulating semiconductor chips | Chang-Seong Jeon, Seung-Hun Shin, Jae-Kyung Yoo | 2020-12-15 |
| 9721930 | Semiconductor package and method for fabricating the same | Hyoungjoo Lee, Minsoo Kim, Young Kun Jee | 2017-08-01 |
| 9159651 | Semiconductor packages having TSV and adhesive layer | Ji Hwang Kim, Sang Wook Park, Young Kun Jee | 2015-10-13 |
| 9136260 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Ho-Geon Song, Sung-jun Im, Chang-Seong Jeon +1 more | 2015-09-15 |
| 9082871 | Substrate of semiconductor package and method of fabricating semiconductor package using the same | Gi-Jun Park, Won Keun Kim, Chang-Seong Jeon, Young Kun Jee | 2015-07-14 |
| 8987904 | Substrate of semiconductor package and method of fabricating semiconductor package using the same | Gi-Jun Park, Won Keun Kim, Chang-Seong Jeon, Young Kun Jee | 2015-03-24 |
| 8846446 | Semiconductor package having buried post in encapsulant and method of manufacturing the same | Pyoung-Wan Kim, Chul-Yong Jang | 2014-09-30 |
| 8637350 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Ho-Geon Song, Sung-jun Im, Chang-Seong Jeon +1 more | 2014-01-28 |
| 8637969 | Stacked chips in a semiconductor package | Won Keun Kim, Dong-Hyeon Jang, Ho-Geon Song, Sung-jun Im | 2014-01-28 |
| 8455301 | Method of fabricating stacked chips in a semiconductor package | Won Keun Kim, Dong-Hyeon Jang, Ho-Geon Song, Sung-jun Im | 2013-06-04 |
| 8344497 | Semiconductor package and electronic device having the same | Pyoung-Wan Kim, Eun-Chul Ahn, Chul-Yong Jang | 2013-01-01 |
| 8154122 | Semiconductor package and methods of manufacturing the semiconductor package | Chul-Yong Jang, Pyoung-Wan Kim | 2012-04-10 |
| 8093703 | Semiconductor package having buried post in encapsulant and method of manufacturing the same | Pyoung-Wan Kim, Chul-Yong Jang | 2012-01-10 |
| 8008771 | Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device | Pyoung-Wan Kim, Eun-Chul Ahn, Jong Ho Lee, Chul-Yong Jang | 2011-08-30 |
| 7807512 | Semiconductor packages and methods of fabricating the same | Pyoung-Wan Kim, Nam-Seog Kim, Chul-Yong Jang | 2010-10-05 |