Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074141 | Semiconductor package | Seung-Hun Shin, Un-Byoung Kang, Yeong Kwon Ko, Jong Ho Lee, Teak-Hoon Lee | 2024-08-27 |
| 11069541 | Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same | Yeong Kwon Ko, Un-Byoung Kang | 2021-07-20 |
| 10804212 | Semiconductor device and package including modified region of less density at edge of device or substrate | Yeong Kwon Ko, Un-Byoung Kang, Ja-Yeon Lee | 2020-10-13 |