Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074141 | Semiconductor package | Seung-Hun Shin, Un-Byoung Kang, Jong Ho Lee, Teak-Hoon Lee, Jun Yeong Heo | 2024-08-27 |
| 11069541 | Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same | Jun Yeong Heo, Un-Byoung Kang | 2021-07-20 |
| 10804212 | Semiconductor device and package including modified region of less density at edge of device or substrate | Jun Yeong Heo, Un-Byoung Kang, Ja-Yeon Lee | 2020-10-13 |
| 10403603 | Semiconductor package and fabrication method thereof | Seung Won Park | 2019-09-03 |
| 9893018 | Alignment mark for semiconductor device | Tae Hyeong Kim, Ji Hwang Kim, Sun-kyoung Seo, Tae-Je Cho | 2018-02-13 |
| 9449930 | Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same | Tae Hyeong Kim, Ji Hwang Kim, Sun-kyoung Seo, Tae-Je Cho | 2016-09-20 |
| 8816407 | Semiconductor package | Jong-Yeon Kim, Tae Hong Min, Tae-Je Cho | 2014-08-26 |