Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11663954 | Display device | Young-Soo Yoon, Yun Kyeong In, Su Kyoung Kim, Won-Se Lee, Yu Jin Jeon +1 more | 2023-05-30 |
| 11616116 | Display device including dummy lines overlapping connection lines | Yu Jin Jeon, Dae Suk Kim, Jun Yong An, Won-Se Lee | 2023-03-28 |
| 11195449 | Display device | Young-Soo Yoon, Yun Kyeong In, Su Kyoung Kim, Won-Se Lee, Yu Jin Jeon +1 more | 2021-12-07 |
| 11031347 | Semiconductor packages | Young Lyong Kim, Hyun-Soo Chung | 2021-06-08 |
| 10438899 | Semiconductor packages | Young Lyong Kim, Hyun-Soo Chung | 2019-10-08 |
| 9941196 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Ho-Geon Song, Se-Young Jeong, Un-Byoung Kang +1 more | 2018-04-10 |
| 9343361 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Ho-Geon Song, Se-Young Jeong, Un-Byoung Kang +1 more | 2016-05-17 |
| 9245827 | 3D semiconductor device | Uk-Song Kang, Seong-Jin Jang, Hoon Lee, Jin Ho Kim, Nam-Seog Kim +2 more | 2016-01-26 |
| 9136260 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Ho-Geon Song, Sung-jun Im, Chang-Seong Jeon, Teak-Hoon Lee +1 more | 2015-09-15 |
| 8743582 | 3D semiconductor device | Uk-Song Kang, Seong-Jin Jang, Hoon Lee, Jin Ho Kim, Nam-Seog Kim +2 more | 2014-06-03 |
| 8735276 | Semiconductor packages and methods of manufacturing the same | Hyun-Soo Chung, Jae-Shin Cho, Dong-Ho Lee, Seong-Deok Hwang, Seung-Duk Baek | 2014-05-27 |
| 8637350 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Ho-Geon Song, Sung-jun Im, Chang-Seong Jeon, Teak-Hoon Lee +1 more | 2014-01-28 |
| 8637969 | Stacked chips in a semiconductor package | Teak-Hoon Lee, Won Keun Kim, Ho-Geon Song, Sung-jun Im | 2014-01-28 |
| 8592991 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Ho-Geon Song, Se-Young Jeong, Un-Byoung Kang +1 more | 2013-11-26 |
| 8455301 | Method of fabricating stacked chips in a semiconductor package | Teak-Hoon Lee, Won Keun Kim, Ho-Geon Song, Sung-jun Im | 2013-06-04 |
| 8368231 | Chipstack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Seung-Duk Baek, Jae-Sik Chung | 2013-02-05 |
| 8362621 | Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same | Ho-Jin Lee, Nam-Seog Kim, In-Young Lee, Ha Young Yim | 2013-01-29 |
| 8119448 | Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same | Son-Kwan Hwang, In-Young Lee, Ho-Jin Lee | 2012-02-21 |
| 8110922 | Wafer level semiconductor module and method for manufacturing the same | Hyun-Soo Chung, Seung-Duk Baek, Dong-Ho Lee, Seong-Deok Hwang | 2012-02-07 |
| 7977156 | Chipstack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Seung-Duk Baek, Jae-Sik Chung | 2011-07-12 |
| 7923296 | Board on chip package and method of manufacturing the same | Hyun-Soo Chung, Dong-Ho Lee, In-Young Lee | 2011-04-12 |
| 7855144 | Method of forming metal lines and bumps for semiconductor devices | Soon-Bum Kim, Sung-Min Sim, Jae-Sik Chung, Se-Yong Oh | 2010-12-21 |
| 7825495 | Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package | Seung-Kwan Ryu, Hee-Kook Choi, Sung-Min Sim | 2010-11-02 |
| 7598607 | Semiconductor packages with enhanced joint reliability and methods of fabricating the same | Hyun-Soo Chung, Nam-Seog Kim, Sun-Won Kang | 2009-10-06 |
| 7592709 | Board on chip package and method of manufacturing the same | Hyun-Soo Chung, Dong-Ho Lee, In-Young Lee | 2009-09-22 |