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Semiconductor device having solder joint and method of forming the same |
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Method of forming metal lines and bumps for semiconductor devices |
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2010-12-21 |
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Interconnection structure of integrated circuit chip |
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Fabrication method of wafer level chip scale packages |
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Interconnection structure of integrated circuit chip |
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2007-12-11 |
| 7271084 |
Reinforced solder bump structure and method for forming a reinforced solder bump |
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Method of fabricating ultra thin flip-chip package |
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| 7151009 |
Method for manufacturing wafer level chip stack package |
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2006-12-19 |
| 7015590 |
Reinforced solder bump structure and method for forming a reinforced solder bump |
Se-Young Jeong, Nam-Seog Kim, Oh-se Yong, Sun Young Park, Ju-hyun Lyu +1 more |
2006-03-21 |
