Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7271084 | Reinforced solder bump structure and method for forming a reinforced solder bump | Se-Young Jeong, Nam-Seog Kim, Soon-Bum Kim, Sun Young Park, Ju-hyun Lyu +1 more | 2007-09-18 |
| 7015590 | Reinforced solder bump structure and method for forming a reinforced solder bump | Se-Young Jeong, Nam-Seog Kim, Soon-Bum Kim, Sun Young Park, Ju-hyun Lyu +1 more | 2006-03-21 |