SJ

Se-Young Jeong

Samsung: 20 patents #6,655 of 75,807Top 9%
KI Korea Electrotechnology Research Institute: 1 patents #126 of 315Top 40%
Overall (All Time): #135,517 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 1–25 of 28 patents

Patent #TitleCo-InventorsDate
12386108 Large-area single-crystal silver thin-film structure using single-crystal copper thin-film buffer layer and manufacturing method therefor Su Jae Kim, You Sil Lee 2025-08-12
12180578 RF sputtering apparatus for controlling atomic layer of thin film You Sil Lee, Su Jae Kim, Sang-Eon Park, Mi Yeon Cheon 2024-12-31
11527488 Semiconductor package and method for manufacturing the same Kisu Joo, Kyu Jae LEE, Seungjae Lee 2022-12-13
10849258 Electronic component package for electromagnetic interference shielding and method for manufacturing the same Ki Su Joo, Ju Young Lee, Jeong Woo Hwang, Jin Ho Yoon 2020-11-24
10512959 Method for manufacturing single-crystalline metal ultrafine wire Sang-Eon Park, Seung Hun Lee, Seung Hwa Jeong, Hoon-chul Yang 2019-12-24
10460852 Electrode having nano mesh multi-layer structure, using single crystal copper, and manufacturing method therefor Ji-Young Kim, Won-Kyung Kim 2019-10-29
9974215 Electronic component package for electromagnetic interference shielding and method for manufacturing the same Ki Su Joo, Ju Young Lee, Jeong Woo Hwang, Jin Ho Yoon 2018-05-15
9941196 Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Ho-Geon Song, Un-Byoung Kang +1 more 2018-04-10
9343361 Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Ho-Geon Song, Un-Byoung Kang +1 more 2016-05-17
8663388 Method of manufacturing single crystal wire and other single crystal metallic articles Chae Ryong Cho, Sang-Eon Park, Sung Kyu Kim 2014-03-04
8592988 Semiconductor device Ho-Jin Lee, Sung-Dong Cho, Yeong-Lyeol Park, Sin-Woo Kang 2013-11-26
8592991 Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Ho-Geon Song, Un-Byoung Kang +1 more 2013-11-26
8586477 Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package Ho-Jin Lee, Ho-Geon Song, Jae-hyun Phee 2013-11-19
7732319 Interconnection structure of integrated circuit chip Sung-Min Sim, Soon-Bum Kim, In-Young Lee, Young-Hee Song 2010-06-08
7666690 System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack Kang-Wook Lee 2010-02-23
7638365 Stacked chip package and method for forming the same Nam-Seog Kim, Cha-Jea Jo, Jong Ho Lee, Myeong-Soon Park 2009-12-29
7553751 Method of forming solder bump with reduced surface defects Jin Choi, Nam-Seog Kim, Kang-Wook Lee 2009-06-30
7524763 Fabrication method of wafer level chip scale packages Soon-Bum Kim, Ung-Kwang Kim, Keum-Hee Ma, Young-Hee Song, Sung-Min Sim +2 more 2009-04-28
7338891 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof 2008-03-04
7307342 Interconnection structure of integrated circuit chip Sung-Min Sim, Soon-Bum Kim, In-Young Lee, Young-Hee Song 2007-12-11
7300864 Method for forming solder bump structure Keum-Hee Ma, Dong-Hyeon Jang, Gu-Sung Kim 2007-11-27
7271084 Reinforced solder bump structure and method for forming a reinforced solder bump Nam-Seog Kim, Oh-se Yong, Soon-Bum Kim, Sun Young Park, Ju-hyun Lyu +1 more 2007-09-18
7214604 Method of fabricating ultra thin flip-chip package Soon-Bum Kim, Se-Yong Oh, Nam-Seog Kim 2007-05-08
7208842 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof 2007-04-24
7151009 Method for manufacturing wafer level chip stack package Soon-Bum Kim, Ung-Kwang Kim, Kang-Wook Lee, Young-Hee Song, Sung-Min Sim 2006-12-19