Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7132358 | Method of forming solder bump with reduced surface defects | Jin Choi, Nam-Seog Kim, Kang-Wook Lee | 2006-11-07 |
| 7119425 | Stacked multi-chip semiconductor package improving connection reliability of stacked chips | Kang-Wook Lee | 2006-10-10 |
| 7015590 | Reinforced solder bump structure and method for forming a reinforced solder bump | Nam-Seog Kim, Oh-se Yong, Soon-Bum Kim, Sun Young Park, Ju-hyun Lyu +1 more | 2006-03-21 |