Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559002 | Methods of fabricating semiconductor devices with blocking layer patterns | Seung-Taek Lee, Eun-Ji Kim, Sin-Woo Kang, Sung-Dong Cho | 2017-01-31 |
| 9437554 | Semiconductor package having magnetic substance and related equipment | Sang-Wook Ji, Hyoung-Yol Mun, In-Kyum Lee | 2016-09-06 |
| 9293415 | Semiconductor devices including protection patterns and methods of forming the same | Eun-Ji Kim, Sung-Dong Cho, Hyoung-Yol Mun, Seung-Taek Lee | 2016-03-22 |
| 9147640 | Semiconductor devices having back side bonding structures | Woon-Seob Lee, Sin-Woo Kang, Jang Ho Kim, Ki-Young Yun | 2015-09-29 |
| 9087885 | Method of fabricating semiconductor devices having through-silicon via (TSV) structures | Sang-Wook Ji, Hyoung-Yol Mun, In-Kyum Lee | 2015-07-21 |
| 8890282 | Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrate | Woon-Seob Lee, Sin-Woo Kang, Ki-Young Yun, Sung-Dong Cho, Eun-Ji Kim | 2014-11-18 |
| 8841754 | Semiconductor devices with stress relief layers | Sin-Woo Kang, Jang Ho Kim, Woon-Seob Lee, Jong-Hoon Cho, Sung-Dong Cho | 2014-09-23 |
| 8836109 | Semiconductor device and method of manufacturing a semiconductor device | Ki-Young Yun, Ki-Soon Bae, Woon-Seob Lee, Sung-Dong Cho, Sin-Woo Kang +2 more | 2014-09-16 |
| 8729684 | Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the same | Sung-Dong Cho, Sin-Woo Kang | 2014-05-20 |
| 8592988 | Semiconductor device | Ho-Jin Lee, Sung-Dong Cho, Se-Young Jeong, Sin-Woo Kang | 2013-11-26 |
| 7801636 | Method and system for managing wafer processing | Nam-young Lee, Pil-woong Bang | 2010-09-21 |
| 7705621 | Test pattern and method of monitoring defects using the same | Hyock-Jun Lee, Choel-Hwyi Bae, Nam-young Lee, Mi-Joung Lee | 2010-04-27 |