Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437554 | Semiconductor package having magnetic substance and related equipment | Sang-Wook Ji, Hyoung-Yol Mun, Yeong-Lyeol Park | 2016-09-06 |
| 9087885 | Method of fabricating semiconductor devices having through-silicon via (TSV) structures | Sang-Wook Ji, Yeong-Lyeol Park, Hyoung-Yol Mun | 2015-07-21 |