SC

Sung-Dong Cho

Samsung: 13 patents #10,425 of 75,807Top 15%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
KAIST: 1 patents #5,996 of 11,619Top 55%
📍 Hwaseong-si, NY: #12 of 18 inventorsTop 70%
Overall (All Time): #337,197 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
11887840 Semiconductor device and method for manufacturing the same Min Sung Kang, Hyoung-Yol Mun, Jun U Jin, Bo Hyun Kim, Won Hee Cho 2024-01-30
11705386 Semiconductor device including TSV and method of manufacturing the same Kwang Wuk Park, Eun-Ji Kim, Hak Seung Lee, Dae-Suk Lee, Dong-Chan Lim +1 more 2023-07-18
11289402 Semiconductor device including TSV and method of manufacturing the same Kwang Wuk Park, Eun-Ji Kim, Hak Seung Lee, Dae-Suk Lee, Dong-Chan Lim +1 more 2022-03-29
9559002 Methods of fabricating semiconductor devices with blocking layer patterns Seung-Taek Lee, Eun-Ji Kim, Sin-Woo Kang, Yeong-Lyeol Park 2017-01-31
9418915 Semiconductor device and method for fabricating the same Sin-Woo Kang 2016-08-16
9293415 Semiconductor devices including protection patterns and methods of forming the same Eun-Ji Kim, Hyoung-Yol Mun, Yeong-Lyeol Park, Seung-Taek Lee 2016-03-22
8890282 Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrate Woon-Seob Lee, Sin-Woo Kang, Ki-Young Yun, Eun-Ji Kim, Yeong-Lyeol Park 2014-11-18
8841754 Semiconductor devices with stress relief layers Sin-Woo Kang, Jang Ho Kim, Woon-Seob Lee, Jong-Hoon Cho, Yeong-Lyeol Park 2014-09-23
8836109 Semiconductor device and method of manufacturing a semiconductor device Ki-Young Yun, Yeong-Lyeol Park, Ki-Soon Bae, Woon-Seob Lee, Sin-Woo Kang +2 more 2014-09-16
8729684 Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the same Yeong-Lyeol Park, Sin-Woo Kang 2014-05-20
8592988 Semiconductor device Ho-Jin Lee, Se-Young Jeong, Yeong-Lyeol Park, Sin-Woo Kang 2013-11-26
7879720 Methods of forming electrical interconnects using electroless plating techniques that inhibit void formation Woo Jin Jang, Hyung Woo Kim, Bum Ki Moon 2011-02-01
7381468 Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same Kyung Wook Paik, Kyung Woon Jang 2008-06-03
6719917 Method of ashing semiconductor device having metal interconnection 2004-04-13