Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11472933 | Method of uniformly dispersing nickel-plated conductive particles of single layer within polymer film by applying magnetic field to polymer film and method of fabricating anisotropic conductive film using the same | Dal-Jin Yoon, Junho BYEON | 2022-10-18 |
| 9376541 | Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package | Un-Byoung Kang, Tae-Je Cho, Young Kun Jee, Sun-kyoung Seo, Yong Won Choi +1 more | 2016-06-28 |
| 8486318 | Fiber, fiber aggregate and adhesive having the same | Deok-Hoon Kim, Kyoung Lim Suk, Jae-Ok Kim | 2013-07-16 |
| 7446384 | CMOS image sensor module with wafers | Myung Jin Yim, Ho Young SON, Yong Min KWON | 2008-11-04 |
| 7381468 | Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same | Kyung Woon Jang, Sung-Dong Cho | 2008-06-03 |
| 6930399 | High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same | Myung Jin Yim | 2005-08-16 |
| 6878435 | High adhesion triple layered anisotropic conductive adhesive film | Myung Jin Yim | 2005-04-12 |
| 6514560 | Method for manufacturing conductive adhesive for high frequency flip chip package applications | Myung Jin Yim, Woon-Seong Kwon | 2003-02-04 |
| 6362090 | Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method | Jae-Woong Nah, Young Doo Jeon, Myung Jin Yim | 2002-03-26 |
| 6238597 | Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate | Myung Jin Yim | 2001-05-29 |
| 6188129 | Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer | Jin Su Kim, Hyoung-soo Ko | 2001-02-13 |
| 6124149 | Method of making stackable semiconductor chips to build a stacked chip module | Jin Su Kim, Hyung Su Ko | 2000-09-26 |
| 5879964 | Method for fabricating chip size packages using lamination process | Se Young Jang | 1999-03-09 |
| 5849623 | Method of forming thin film resistors on organic surfaces | Robert J. Wojnarowski, James Wilson Rose, Michael Gdula | 1998-12-15 |
| 5776275 | Fabrication of compact magnetic circulator components in microwave packages using high density interconnections | Vikram Krishnamurthy, Mario Ghezzo, William P. Kornrumpf, Eric J. Wildi | 1998-07-07 |
| 5675310 | Thin film resistors on organic surfaces | Robert J. Wojnarowski, James Wilson Rose, Michael Gdula | 1997-10-07 |
| 5653841 | Fabrication of compact magnetic circulator components in microwave packages using high density interconnections | Vikram Krishnamurthy, Mario Ghezzo, William P. Kornrumpf, Eric J. Wildi | 1997-08-05 |
| 5418002 | Direct bonding of copper to aluminum nitride substrates | Constantine A. Neugebauer | 1995-05-23 |
| 5352629 | Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules | William Andrew Hennessy, Wolfgang Daum | 1994-10-04 |
| 5304847 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Homer H. Glascock, II, James G. McMullen | 1994-04-19 |
| 5206186 | Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding | Constantine A. Neugebauer, Homer H. Glascock, II, James G. McMullen | 1993-04-27 |
| 5184206 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Homer H. Glascock, II, James G. McMullen, Martha M. Neugebauer | 1993-02-02 |