Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935952 | Semiconductor devices | Han Wool Park, Se Jin Park, No Young Chung | 2024-03-19 |
| 11908819 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Jun Zhai, Yifan Kao, Taegui Kim | 2024-02-20 |
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Jun Zhai, Yifan Kao, Taegui Kim | 2023-01-03 |
| 11469325 | Semiconductor devices | Han Wool Park, Se Jin Park, No Young Chung | 2022-10-11 |
| 9548288 | Integrated circuit die decoupling system with reduced inductance | Vidhya Ramachandran, Chonghua Zhong, Shawn Searles, Jun Zhai, Huabo Chen | 2017-01-17 |
| 6362090 | Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method | Kyung Wook Paik, Jae-Woong Nah, Myung Jin Yim | 2002-03-26 |