Home › Intel › Myung Jin Yim

MY

Myung Jin Yim — 27 Patents

Intel: 10 patents #4,072 of 30,777Top 15%

KAIST: 7 patents #1,829 of 11,619Top 20%

Micron: 7 patents #1,886 of 6,374Top 30%

Globalfoundries: 2 patents #1,397 of 4,424Top 35%

Chandler, AZ: #184 of 3,331 inventorsTop 6%

Arizona: #1,133 of 32,909 inventorsTop 4%

Overall (All Time): #142,059 of 4,157,543Top 4%

27 Patents All Time

Myung Jin Yim has been granted 27 US patents while listed as an inventor at Intel. The first was granted in 2001 and the most recent in September 2024. Myung Jin Yim ranks #142,059 of 4,157,543 US inventors in our database (top 3.4%). Patent records list Myung Jin Yim in Chandler, AZ, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 27 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12078853	Semiconductor package with embedded optical die	Vivek Raghunathan	2024-09-03	$14,017,000
11982854	Co-packaging with silicon photonics hybrid planar lightwave circuit	Sang Yup Kim, Woosung Kim	2024-05-14	$33,809,000
11531174	Co-packaging with silicon photonics hybrid planar lightwave circuit	Sang Yup Kim, Woosung Kim	2022-12-20	$12,719,000
11156788	Semiconductor package with embedded optical die	Vivek Raghunathan	2021-10-26	$21,268,000
10953593	Molding compound including a carbon nano-tube dispersion	Jason M. Brand	2021-03-23	$19,320,000
10727368	Optoelectronic device module having a silicon interposer	Seungjae Lee, Sandeep Razdan	2020-07-28	$26,273,000
10347615	Method of fabricating an optical module that includes an electronic package	Jay Lee, Jong-Min Hong	2019-07-09	$19,303,000
10242976	In-package photonics integration and assembly architecture	—	2019-03-26	$18,583,000
10014654	Optoelectronic packaging assemblies	Ansheng Liu, Valentin Yepanechnikov	2018-07-03	$24,450,000
9950464	Forming a carbon nano-tube dispersion	Jason M. Brand	2018-04-24	$55,411,000
9900102	Integrated circuit with chip-on-chip and chip-on-substrate configuration	Olufemi I. Dosunmu, Ansheng Liu	2018-02-20	$17,556,000
9893816	Dynamic beam steering optoelectronic packages	Woosung Kim	2018-02-13	$15,494,000
9374902	Package including an underfill material in a portion of an area between the package and a substrate or another package	Nanette Quevedo, Richard Strode	2016-06-21	$13,684,000
9041228	Molding compound including a carbon nano-tube dispersion	Jason M. Brand	2015-05-26	$11,470,000
8653675	Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation	James Zhang, Jason M. Brand, Jacob Brooksby, Dejen Eshete, Ravikumar Adimula +1 more	2014-02-18	$12,380,000
8451620	Package including an underfill material in a portion of an area between the package and a substrate or another package	Nanette Quevedo, Richard Strode	2013-05-28	$4,107,000
8409927	Methods for fabricating integrated circuit systems including high reliability die under-fill	—	2013-04-02	$3,373,000
8383460	Method for fabricating through substrate vias in semiconductor substrate	—	2013-02-26	$1,610,000
8344491	Multi-die building block for stacked-die package	Ravikumar Adimula	2013-01-01
7446384	CMOS image sensor module with wafers	Kyung Wook Paik, Ho Young SON, Yong Min KWON	2008-11-04
7081675	Multilayered anisotropic conductive adhesive for fine pitch	Jun Sang Hwang	2006-07-25
6930399	High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same	Kyung Wook Paik	2005-08-16
6878435	High adhesion triple layered anisotropic conductive adhesive film	Kyung Wook Paik	2005-04-12
6518097	Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive	Kyung Wook Baik	2003-02-11
6514560	Method for manufacturing conductive adhesive for high frequency flip chip package applications	Kyung Wook Paik, Woon-Seong Kwon	2003-02-04