Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12078853 | Semiconductor package with embedded optical die | Vivek Raghunathan | 2024-09-03 |
| 11982854 | Co-packaging with silicon photonics hybrid planar lightwave circuit | Sang Yup Kim, Woosung Kim | 2024-05-14 |
| 11531174 | Co-packaging with silicon photonics hybrid planar lightwave circuit | Sang Yup Kim, Woosung Kim | 2022-12-20 |
| 11156788 | Semiconductor package with embedded optical die | Vivek Raghunathan | 2021-10-26 |
| 10953593 | Molding compound including a carbon nano-tube dispersion | Jason M. Brand | 2021-03-23 |
| 10727368 | Optoelectronic device module having a silicon interposer | Seungjae Lee, Sandeep Razdan | 2020-07-28 |
| 10347615 | Method of fabricating an optical module that includes an electronic package | Jay Lee, Jong-Min Hong | 2019-07-09 |
| 10242976 | In-package photonics integration and assembly architecture | — | 2019-03-26 |
| 10014654 | Optoelectronic packaging assemblies | Ansheng Liu, Valentin Yepanechnikov | 2018-07-03 |
| 9950464 | Forming a carbon nano-tube dispersion | Jason M. Brand | 2018-04-24 |
| 9900102 | Integrated circuit with chip-on-chip and chip-on-substrate configuration | Olufemi I. Dosunmu, Ansheng Liu | 2018-02-20 |
| 9893816 | Dynamic beam steering optoelectronic packages | Woosung Kim | 2018-02-13 |
| 9374902 | Package including an underfill material in a portion of an area between the package and a substrate or another package | Nanette Quevedo, Richard Strode | 2016-06-21 |
| 9041228 | Molding compound including a carbon nano-tube dispersion | Jason M. Brand | 2015-05-26 |
| 8653675 | Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation | James Zhang, Jason M. Brand, Jacob Brooksby, Dejen Eshete, Ravikumar Adimula +1 more | 2014-02-18 |
| 8451620 | Package including an underfill material in a portion of an area between the package and a substrate or another package | Nanette Quevedo, Richard Strode | 2013-05-28 |
| 8409927 | Methods for fabricating integrated circuit systems including high reliability die under-fill | — | 2013-04-02 |
| 8383460 | Method for fabricating through substrate vias in semiconductor substrate | — | 2013-02-26 |
| 8344491 | Multi-die building block for stacked-die package | Ravikumar Adimula | 2013-01-01 |
| 7446384 | CMOS image sensor module with wafers | Kyung Wook Paik, Ho Young SON, Yong Min KWON | 2008-11-04 |
| 7081675 | Multilayered anisotropic conductive adhesive for fine pitch | Jun Sang Hwang | 2006-07-25 |
| 6930399 | High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same | Kyung Wook Paik | 2005-08-16 |
| 6878435 | High adhesion triple layered anisotropic conductive adhesive film | Kyung Wook Paik | 2005-04-12 |
| 6518097 | Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive | Kyung Wook Baik | 2003-02-11 |
| 6514560 | Method for manufacturing conductive adhesive for high frequency flip chip package applications | Kyung Wook Paik, Woon-Seong Kwon | 2003-02-04 |