Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8653675 | Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation | James Zhang, Jason M. Brand, Jacob Brooksby, Dejen Eshete, Myung Jin Yim +1 more | 2014-02-18 |
| 8344491 | Multi-die building block for stacked-die package | Myung Jin Yim | 2013-01-01 |