{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation", "item": "https://www.patentleaderboard.com/patent/8653675"}]}
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Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation

US Patent 8653675 · Granted Feb 18, 2014

Estimated economic value: $12,380,000

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