Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Co-packaging with silicon photonics hybrid planar lightwave circuit

Co-packaging with silicon photonics hybrid planar lightwave circuit

US Patent 11982854 · Granted May 14, 2024

Estimated economic value: $33,809,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Modular type multi-plex PCR apparatus2025
Activating new device based on container in vehicle2025
Semiconductor package with embedded optical die2024
Update of seamless container in vehicles system based on container2024
Activating new device based on container in vehicle2024
Photomask, exposure apparatus, and method of fabricating three-dimensional semic2023
Co-packaging with silicon photonics hybrid planar lightwave circuit2022
Co-packaging with silicon photonics hybrid planar lightwave circuit2022
Co-packaging with silicon photonics hybrid planar lightwave circuit2022
Semiconductor package with embedded optical die2021
Molding compound including a carbon nano-tube dispersion2021
Optical modulator-based transmission control2020