Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8653675 | Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation | James Zhang, Jason M. Brand, Jacob Brooksby, Myung Jin Yim, Ravikumar Adimula +1 more | 2014-02-18 |
| 7332801 | Electronic device | Ai Ling Low | 2008-02-19 |