Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8653675 | Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation | James Zhang, Jason M. Brand, Jacob Brooksby, Dejen Eshete, Myung Jin Yim +1 more | 2014-02-18 | $12,380,000 |