{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for fabricating through substrate vias in semiconductor substrate", "item": "https://www.patentleaderboard.com/patent/8383460"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for fabricating through substrate vias in semiconductor substrate

Method for fabricating through substrate vias in semiconductor substrate

US Patent 8383460 · Granted Feb 26, 2013

Estimated economic value: $1,610,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package with embedded optical die2024
Co-packaging with silicon photonics hybrid planar lightwave circuit2024
Co-packaging with silicon photonics hybrid planar lightwave circuit2022
Semiconductor package with embedded optical die2021
Molding compound including a carbon nano-tube dispersion2021
Optoelectronic device module having a silicon interposer2020
Method of fabricating an optical module that includes an electronic package2019
In-package photonics integration and assembly architecture2019
Optoelectronic packaging assemblies2018
Forming a carbon nano-tube dispersion2018
Integrated circuit with chip-on-chip and chip-on-substrate configuration2018
Dynamic beam steering optoelectronic packages2018